Table of contents

The following topics are dealt with: Flip Chip Packaging; 3D Technology: TSV Fabrication and Reliability; Solder Joint Reliability; Adhesives, Underfills, and Thermal Interface Materials; Novel Manufacturing Solutions; 3D Technology: High-Speed Components and Modeling; Interposer Technology; 3D Technology: TSV Bonding Process Development and Characterization; Advancements in Substrate Technologies; Advanced Reliability Tests and Failure Analysis Methodologies; Thermal Compression Bonding: Challenges and Process Improvement; Advances in Signal Integrity; 3D Integration, TSV, and Reliability; Flip Chip: Bonding, Chip-Package Interaction, and Electromigration; 3D Technology: Materials and Reliability; Wearable, Bendable, Flexible Electronics; Advances in Power Integrity and Electromagnetic Interference; Advanced Optical Interconnects; 3D Technology: Thermal and Performance Reliability; Wafer Level Packaging and PoP; 3D Materials and Processing; Packaging for Internet of Things; Emerging Wireless Technologies; Advanced Modeling in Solder Joints, TSVs, and Copper Wire Bonding; Fan-Out and Wafer Level Packaging; Innovative Interconnection Technologies; 3D Technology: Thermal Materials and Modeling; Emerging Interconnects; Lead-Free Solder Joints; Silicon Photonics and Light Sources; MEMS and Sensors; Packaging for Power and Wirebond Innovations; 3D Technology: Latest Innovations; Package Warpage, Delamination, and Thermal Modeling; and Static and Dynamic Interconnect Reliability.