Title :
Low-profile fully integrated 60 GHz 18 element phased array on multilayer liquid crystal polymer flip chip package
Author :
Kamgaing, Telesphor ; Elsherbini, Adel A. ; Oster, Sasha N. ; Cohen, Emanuel
Author_Institution :
Components Res., Intel Corp., Hillsboro, AZ, USA
Abstract :
We present an ultra-thin, low cost, fully integrated 60GHz phased array antenna module supporting 18 TX/RX antenna elements for 60 GHz WiGig applications. The RFIC is assembled on a 15 mm × 12 mm liquid crystal polymer (LCP) package containing the antenna elements. All millimeter-wave signal routing was done on the same layer as the die pads to minimize the number of package substrate layers (4 total metal layers) and achieve very small total package thickness of 0.41 mm. The measurement results for the package showed good agreement with the simulation. The measured peak directivity of the steerable array was 17.4 dBi and routing losses were 0.5 - 1dB.
Keywords :
antenna phased arrays; flip-chip devices; integrated circuit packaging; liquid crystal polymers; millimetre wave integrated circuits; LCP package; RFIC; RX antenna elements; TX antenna elements; WiGig application; flip chip package; frequency 60 GHz; millimeter-wave signal routing; multilayer liquid crystal polymer package; package substrate layers; phased array antenna module; size 0.41 mm; size 12 mm; size 15 mm; Arrays; Metals; Phased arrays; Routing; Substrates; Transmission line measurements;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159716
