• DocumentCode
    723113
  • Title

    Through Glass Via (TGV) disc loaded monopole antennas for millimeter-wave wireless interposer communication

  • Author

    Seahee Hwangbo ; Rahimi, Arian ; Cheolbok Kim ; Hae-Yong Yang ; Yong-Kyu Yoon

  • Author_Institution
    Univ. of Florida, Gainesville, FL, USA
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    999
  • Lastpage
    1004
  • Abstract
    A monopole antenna loaded with a circular disc is integrated on a glass interposer layer for millimeter-wave wireless communication applications. A Through Glass Via (TGV) is used as a main radiator and the circular disc is for a impedance matching. An omnidirectional radiation pattern formed by the monopole antenna allows in-plane wireless communication whose distance is much larger than 1cm. This can solve problems such as cross talk and time delay caused by the conventional wire bonding approach. A 77 GHz (W-band) antenna is designed and fabricated as a prototype on a glass substrate. The simulated peak gain of the antenna is 1.23 dBi. Also, as this antenna concept is scalable, the same architecture has been exercised for a 5.8 GHz industrial, scientific and medical, ISM band application. The design, fabrication, and characterization are detailed. The measured results of the return loss and radiation pattern agree well with the simulation results.
  • Keywords
    impedance matching; integrated circuit interconnections; integrated circuit packaging; millimetre wave antennas; monopole antennas; three-dimensional integrated circuits; W-band antenna; frequency 77 GHz; glass interposer layer; impedance matching; millimeter wave wireless interposer communication; omnidirectional radiation pattern; through glass via disc loaded monopole antennas; Antenna measurements; Antenna radiation patterns; Glass; Loaded antennas; Loss measurement; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159717
  • Filename
    7159717