Crystal plasticity finite element analysis of electromigration-induced deformation behavior in lead-free solder joints

The elastic and plastic anisotropy of β-Sn has an important effect on the stress state, and hence the electromigration induced degradation in Sn-based solder joints. A crystal plasticity model is developed to capture this effect. Calibration of this model is done by using the available literature data. Future refinement of the slip parameters is needed to optimize the model. The model is implemented in a finite element framework and is used to simulate the response of single crystal β-Sn to electromigration induced strains. This work can be used as a basis for future development of coupled models of electromigration and stress induced degradation in Sn-based solders.