DocumentCode :
723142
Title :
All solid-state multi-chip multi-channel WDM photonic module
Author :
Shubin, I. ; Zheng, X. ; Thacker, H. ; Djordjevic, S.S. ; Lin, S. ; Amberg, P. ; Lexau, J. ; Raj, K. ; Cunningham, J.E. ; Krishnamoorthy, A.V.
Author_Institution :
Oracle, San Diego, CA, USA
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
1293
Lastpage :
1298
Abstract :
In this work we report on a packaged prototype of a WDM photonic transceiver. It is a hybrid assembly based on a 130 nm SOI photonic circuitry integrated with a 40 nm CMOS VLSI driver. Our prototype supports eight tunable WDM channels operating at 10 Gb/s each capable of both transmitting and receiving data on the same chip. We discuss two options to close the link while using the optical fiber or another waveguide bridge chip. We provide hybridization details and supporting link measurement data to describe packaged photonic module and its power efficient functionality as its on-chip power per channel averaged 1.3pJ/bit, laser electrical power excluded.
Keywords :
CMOS integrated circuits; integrated optics; multichip modules; optical transceivers; wavelength division multiplexing; CMOS VLSI driver; SOI photonic circuitry; WDM photonic transceiver; bit rate 10 Gbit/s; hybrid assembly; link measurement data; optical fiber; packaged photonic module; size 130 nm; size 40 nm; solid-state multichip multichannel WDM photonic module; tunable WDM channels; waveguide bridge chip; Couplers; Optical fibers; Photonics; Silicon; Very large scale integration; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/ECTC.2015.7159764
Filename :
7159764
Link To Document :
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