Title :
Thermally enhanced FOWLP-development of a Power-eWLB demonstrator
Author :
Cardoso, Andre ; Pires, Mariana ; Pinto, Raquel ; Hantos, Gusztav
Author_Institution :
NANIUM S.A., Vila do Conde, Portugal
Abstract :
Current Fan Out Wafer Level Packaging (FOWLP) technology, eWLB, has limited heat dissipation capability, as the materials used in, namely the epoxy mold compound (EMC), originally aimed process ability and mechanical stability, but not heat conduction. As eWLB technology expands to WLSiP (Wafer Level System-in-Package) for very high system integration density, combining multiple chips and different components in the same package, the thermal performance becomes a critical factor. In a broader scope, the improvement of its heat dissipation capabilities opens eWLB technology platform also to power applications.
Keywords :
adhesives; cooling; encapsulation; heat conduction; heat sinks; insulation; mechanical stability; resins; system-in-package; wafer level packaging; EMC; European FP7ICT project NANOTHERM; IDM; NANIUM eWLB technology; OEM; OSAT; TIM; WLSiP; adhesive; assembly process; eWLB package; electrical conductor; electrical insulator; encapsulated package; epoxy mold compound; fan out wafer level packaging technology; heat conduction; heat dissipation capability; heat spreader; high system integration density; inorganic filler; integrated heat sink; mechanical bonding; mechanical stability; metal-metal interface; metallic heat spreader; multipattern heating; multiple chip combination; organic resin; organic-metal interface; power application; power-eWLB demonstrator; thermal characterization; thermal dissipation; thermal interface material; thermally enhanced FOWLP technology; wafer level system-in-package; Bonding; Conductors; Reliability; Resistance heating; Silicon; Thermal conductivity;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159823
