• DocumentCode
    723213
  • Title

    Noise coupling emulation between TSV and active circuit through metal oxide patch

  • Author

    Manho Lee ; Jonghyun Cho ; Jaemin Lim ; Joungho Kim

  • Author_Institution
    Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    1945
  • Lastpage
    1949
  • Abstract
    In this paper, we measure the noise coupling of metal oxide patch and propose the emulation process for the noise coupling between TSV and active circuit by substituting TSV to metal oxide patch. For that, we utilize the analysis of noise coupling of TSV by dividing frequency range. With this results, the system designer can anticipate the effect of noise coupling between TSV and active circuit without fabricating TSV-included active circuit.
  • Keywords
    active networks; integrated circuit manufacture; integrated circuit noise; three-dimensional integrated circuits; TSV; active circuit; metal oxide patch; noise coupling emulation; through-silicon-via; Active circuits; Couplings; Metals; Noise; Noise measurement; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159867
  • Filename
    7159867
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=723213