Title :
Noise coupling emulation between TSV and active circuit through metal oxide patch
Author :
Manho Lee ; Jonghyun Cho ; Jaemin Lim ; Joungho Kim
Author_Institution :
Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
In this paper, we measure the noise coupling of metal oxide patch and propose the emulation process for the noise coupling between TSV and active circuit by substituting TSV to metal oxide patch. For that, we utilize the analysis of noise coupling of TSV by dividing frequency range. With this results, the system designer can anticipate the effect of noise coupling between TSV and active circuit without fabricating TSV-included active circuit.
Keywords :
active networks; integrated circuit manufacture; integrated circuit noise; three-dimensional integrated circuits; TSV; active circuit; metal oxide patch; noise coupling emulation; through-silicon-via; Active circuits; Couplings; Metals; Noise; Noise measurement; Silicon; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159867
