DocumentCode :
723521
Title :
SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications
Author :
Cenni, Fabio ; Guillaume, Olivier ; Diaz-Nava, Mario ; Maehne, Torsten
Author_Institution :
STMicroelectron. (Grenoble) SAS, Grenoble, France
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
6
Abstract :
This paper aims at providing guidelines to select the right modeling style for MEMS simulation in order to perform system analysis. This paper presents how an application with micro-electro-mechanical system (MEMS) sensors controlled by software can be modeled and simulated at high abstraction level. The overall modeling and simulation methodology lies on the extensions of SystemC named SystemC AMS/MDVP. In order to illustrate our approach, a case study is presented which integrate three-axis MEMS containing an accelerometer, a gyroscope, a magnetometer, and its associated CPU. A special focus is put on the MEMS gyroscope.
Keywords :
accelerometers; electronic design automation; gyroscopes; magnetometers; microsensors; virtual prototyping; MDVP-based model; MEMS gyroscope; MEMS sensor; MEMS simulation; SystemC-AMS-based model; accelerometer; high abstraction level; magnetometer; microelectromechanical system; three-axis MEMS; virtual prototyping; Data models; Gyroscopes; Integrated circuit modeling; Mathematical model; Micromechanical devices; Registers; Sensors; Micro-Electro-Mechanical System (MEMS); Multi-Domain Virtual Prototyping (MDVP); SystemC AMS; Timed Data Flow (TDF); Transaction-Level Modeling (TLM); block diagram; bond graph; dimensional analysis; finite element analysis; reduced-order modeling; software validation; virtual prototyping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7160972
Filename :
7160972
Link To Document :
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