DocumentCode
723536
Title
Detecting response of square and circular Si/AlN/Al membranes transducers by Laser Vibrometry Doppler and Impedancemeter
Author
Herth, Etienne ; Lardet-Vieudrin, Franck ; Valbin, Laurie ; Algre, Emmanuelle
Author_Institution
FEMTO-ST, Univ. de Franche Comte, Besancon, France
fYear
2015
fDate
27-30 April 2015
Firstpage
1
Lastpage
5
Abstract
This paper investigates the vibration analysis of square and circular piezoelectric micro-transducers in the hundred kHz range as a function of experimental tools. These micro-transducers have been actuated by a piezoelectric Aluminum Nitride (AlN) 0.9 μm-thin layer sandwiched between N-doped Silicon (Si) 20μm-thick layer and aluminum (Al) 0.4μm-thin layer. Si/AlN/Al square and circular membranes, with size fixed to 1.5 mm were fabricated using micromachining technology. Analytical and 3D finite element method (3D-FEM) analysis using Comsol software has been performed to model static, modal and vibration behavior of these membranes. Typical numerical simulations and experimental results are presented and discussed. Comparison with standard impedancemeter measurement is shown to assess the performance of Laser Doppler Vibrometry (LDV) system. This work´s main contribution is mechanical and electrical characterization and comparison with a model.
Keywords
aluminium compounds; electric impedance measurement; finite element analysis; micromachining; microsensors; piezoelectric transducers; silicon; vibration measurement; 3D finite element method; 3D-FEM analysis; AlN; Comsol software; Si; circular membranes transducers; circular piezoelectric microtransducer; impedancemeter measurement; laser vibrometry doppler; micromachining technology; piezoelectric aluminum nitride; size 0.4 mum; size 0.9 mum; size 1.55 mm; size 20 mum; square membranes transducers; square piezoelectric microtransducer; vibration analysis; Computational modeling; Displacement measurement; Films; Frequency measurement; Lead; Micromachining; Q measurement; AlN thin film; Aliminum nitride; Laser Vibrometry Doppler; Micro-transducers; piezoelectric film;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location
Montpellier
Print_ISBN
978-1-4799-8627-9
Type
conf
DOI
10.1109/DTIP.2015.7160996
Filename
7160996
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