DocumentCode :
723544
Title :
Narrow-band switching by means of triangular meta-material resonators based on RF MEMS cantilevers in CPW configuration
Author :
Lucibello, A. ; Proietti, E. ; Marcelli, R. ; Sardi, G.M. ; Bartolucci, G.
Author_Institution :
Inst. for Microelectron. & Microsyst., Rome, Italy
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
5
Abstract :
Triangular metamaterial resonators, designed by RF MEMS cantilevers in coplanar waveguide (CPW) configuration, have been fabricated on alumina substrate and tested up to 40 GHz. A triangular split ring resonator has been etched in the central conductor of the CPW transmission line and the split is provided by a technologically actuated cantilever beam, i.e. with metal directly deposited without the sacrificial layer, to emulate the ideal actuation. Two main configurations of the triangular transmission line have been studied for narrowband microwave switching, the first one without the MEMS cantilever and the second one with a technologically actuated MEMS cantilever switch. Because of the contributions of both the resonator and the switch, the device has a narrow band switching feature. Moreover, the parameters extraction obtained by both the experiment and the simulation, show a metamaterial behavior of the exploited configuration.
Keywords :
cantilevers; coplanar waveguides; high-frequency transmission lines; microswitches; microwave metamaterials; millimetre wave resonators; CPW configuration; CPW transmission line; MEMS cantilever switch; RF MEMS cantilevers; alumina substrate; coplanar waveguide configuration; frequency 40 GHz; narrow band switching feature; narrowband microwave switching; triangular metamaterial resonators; triangular split ring resonator; triangular transmission line; Coplanar waveguides; Frequency measurement; Magnetic materials; Metamaterials; Optical ring resonators; Resonant frequency; Switches; CPW metamaterial transmission lines; Triangular resonators; metamaterial resonators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7161005
Filename :
7161005
Link To Document :
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