DocumentCode
723544
Title
Narrow-band switching by means of triangular meta-material resonators based on RF MEMS cantilevers in CPW configuration
Author
Lucibello, A. ; Proietti, E. ; Marcelli, R. ; Sardi, G.M. ; Bartolucci, G.
Author_Institution
Inst. for Microelectron. & Microsyst., Rome, Italy
fYear
2015
fDate
27-30 April 2015
Firstpage
1
Lastpage
5
Abstract
Triangular metamaterial resonators, designed by RF MEMS cantilevers in coplanar waveguide (CPW) configuration, have been fabricated on alumina substrate and tested up to 40 GHz. A triangular split ring resonator has been etched in the central conductor of the CPW transmission line and the split is provided by a technologically actuated cantilever beam, i.e. with metal directly deposited without the sacrificial layer, to emulate the ideal actuation. Two main configurations of the triangular transmission line have been studied for narrowband microwave switching, the first one without the MEMS cantilever and the second one with a technologically actuated MEMS cantilever switch. Because of the contributions of both the resonator and the switch, the device has a narrow band switching feature. Moreover, the parameters extraction obtained by both the experiment and the simulation, show a metamaterial behavior of the exploited configuration.
Keywords
cantilevers; coplanar waveguides; high-frequency transmission lines; microswitches; microwave metamaterials; millimetre wave resonators; CPW configuration; CPW transmission line; MEMS cantilever switch; RF MEMS cantilevers; alumina substrate; coplanar waveguide configuration; frequency 40 GHz; narrow band switching feature; narrowband microwave switching; triangular metamaterial resonators; triangular split ring resonator; triangular transmission line; Coplanar waveguides; Frequency measurement; Magnetic materials; Metamaterials; Optical ring resonators; Resonant frequency; Switches; CPW metamaterial transmission lines; Triangular resonators; metamaterial resonators;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location
Montpellier
Print_ISBN
978-1-4799-8627-9
Type
conf
DOI
10.1109/DTIP.2015.7161005
Filename
7161005
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