Modification of epoxy resin used in high-voltage technology

This paper focused on modified resin that contain epoxy matrix on base improving the thermal conductive, a new composite system was designed by applying new phase represented by the nano or microparticles of silica. In this paper, low quantities bisphenol A (DGEBA) with diamine crosslinker (Laromin C260). In order to assess the challenge of improving the electrical properties while not changing or even of nanosilica were used (1 wt%), which were derived from previous measurements. The sample achieved the best electrical properties with this quantity of nanoparticles. We used also the same quantities of microparticles (1 wt%). The impact of the additional filler on the electrical and thermal properties of the nano and microcomposites were investigated. Using thermal conductivity measurements, it was found that low quantities of microfiller added to the epoxy resin can improve the thermal conductivity. Moreover, using dielectric characterization techniques (volume resistivity, dissipation factor and dielectric breakdown), it was found that the electrical properties of the material with microfiller remain changed or are slightly improved. By contrast, nanoparticles improve electrical properties significantly but slightly increase thermal properties compared to the pure epoxy resin.