DocumentCode :
72384
Title :
Power Electronics Loss Measurement Using New Heat Flux Sensor Based on Thermoelectric Device With Active Control
Author :
Yichao Zhang ; Jahns, Thomas M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI, USA
Volume :
50
Issue :
6
fYear :
2014
fDate :
Nov.-Dec. 2014
Firstpage :
4098
Lastpage :
4106
Abstract :
A new approach is presented for measuring the heat dissipation in power electronic devices using a commercial thermoelectric (TE) module as a heat flux sensor. The proposed sensor takes advantage of both the Seebeck and Peltier TE effects, yielding a new type of heat flux sensor with low thermal resistance and appealing accuracy/resolution characteristics. In order to explain the operating principles of this sensor, attention is focused on the model of the TE module and the method of controlling it as a heat flux sensor. The measured performance of early prototype versions of the sensor exhibits promising agreement with the calculated characteristics. One of the implementations of the proposed control method uses the new generation of thin-film TE modules that can measure higher heat flux values than their bulk-type counterparts, making them more attractive candidates for measuring the high heat flux characteristics of modern power modules.
Keywords :
Peltier effect; Seebeck effect; cooling; loss measurement; power electronics; sensors; thermal management (packaging); thermal variables measurement; thermoelectric devices; Peltier thermoelectric effect; Seebeck thermoelectric effect; active control; commercial thermoelectric module; heat dissipation; heat flux sensor; power electronics loss measurement; power modules; thermoelectric device; Heat sinks; Junctions; Power measurement; Resistance heating; Temperature measurement; Temperature sensors; Calorimetry; loss measurement; power dissipation; power semiconductor switches; thermoelectric devices;
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2014.2316370
Filename :
6786336
Link To Document :
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