Title :
Foreword: Special Section on RF, 3-D-ICs and Interconnects
Author :
Achar, Ramachandra ; Maffucci, A.
Author_Institution :
EPEPS 2011 and EPEPS 2012,
Abstract :
The seven papers in this special section are updated and expanded versions of the papers that appeared in the IEEE CPMT-sponsored conferences: Electrical Performance of Electronic Packaging and Systems (EPEPS) 2011 and 2012, and Workshop on Signal and Power Integrity (SPI) 2011 and 2012.
Keywords :
Integrated circuit interconnections; Integrated circuit modeling; Meetings; Special issues and sections; Through-silicon vias;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2013.2286712
