• DocumentCode
    724300
  • Title

    Influence of thermal and flow distribution for the Czochralski growth process of Si under external magnetic field

  • Author

    Huang Weichao ; Liu Ding ; Zhang Ni

  • Author_Institution
    Sch. of Autom. & Inf. Eng., Xi´an Univ. of Technol., Xi´an, China
  • fYear
    2015
  • fDate
    23-25 May 2015
  • Firstpage
    3314
  • Lastpage
    3318
  • Abstract
    This paper presents the mathematical models of the melt flow and the thermal transfer during the Czochralski crystal growth with an external magnetic field. The thermal and the flow distribution of silicon crystal growth under vertical magnetic field, transverse magnetic field and Cusp magnetic field were studied respectively using two-dimensional axisymmetric model and three-dimensional local model. The numerical simulation experiment was done using TD - 120 type single crystal furnace parameters. The results showed that the improvements of the thermal and the flow distribution of the silicon melt are limited because of the direction of vertical magnetic field and transverse magnetic field is uniform. The Cusp magnetic field can improve the thermal and the flow distribution effectively, boost the thermal stability of the melt zone, suppress impurity content, and improve the crystal quality.
  • Keywords
    crystal growth from melt; elemental semiconductors; magnetic field effects; semiconductor growth; semiconductor process modelling; silicon; Cusp magnetic field; Czochralski crystal growth; Czochralski growth process; crystal furnace parameters; external magnetic field; flow distribution; melt flow; silicon crystal growth; thermal distribution; thermal transfer; three-dimensional local model; transverse magnetic field; two-dimensional axisymmetric model; vertical magnetic field; Crystals; Heating; Magnetic fields; Silicon; Solid modeling; Solids; Crochralski; Magnetic field; Numerical simulation; Silicon crystal growth;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Control and Decision Conference (CCDC), 2015 27th Chinese
  • Conference_Location
    Qingdao
  • Print_ISBN
    978-1-4799-7016-2
  • Type

    conf

  • DOI
    10.1109/CCDC.2015.7162492
  • Filename
    7162492