DocumentCode :
724777
Title :
Analytical investigation of thermal effects on outphasing power amplifiers
Author :
Finnerty, Keith ; Dooley, John ; Farrell, Ronan
Author_Institution :
Dept. Electron. Eng., Maynooth Univ., Maynooth, Ireland
fYear :
2015
fDate :
24-25 June 2015
Firstpage :
1
Lastpage :
5
Abstract :
The outphasing amplifier has alternative linearity requirements when compared with traditional amplifier technology. As a relatively new architecture for mobile communications the physical and electrical causes of nonlinearity have not yet been fully identified. In this work the effect of thermal variations on the characteristic operation of the outphasing amplifier architecture is investigated. More specifically the impact that gain and phase variations which result from a change in device temperature affect the characteristic performance of the outphasing amplifier. Amplifier biasing circuits commonly account for changes in temperature, a process which will result in a shift in characteristic performance. The result demonstrates a shift in characteristic outphasing angle of as much as 2.4 degrees and a reduction in dynamic range greater than 20 dB.
Keywords :
amplification; linearisation techniques; power amplifiers; thermal stability; amplifier biasing circuits; characteristic outphasing angle; device temperature; mobile communications; outphasing power amplifiers; phase variations; thermal variations; Dynamic range; Gain; Impedance; Linearity; Power amplifiers; Power generation; Temperature; Cheriex; GaN; LINC; Outphasing; Thermal;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signals and Systems Conference (ISSC), 2015 26th Irish
Conference_Location :
Carlow
Type :
conf
DOI :
10.1109/ISSC.2015.7163759
Filename :
7163759
Link To Document :
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