• DocumentCode
    725091
  • Title

    Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools

  • Author

    ChanSeob Cho ; Taylor, Ron ; Mungmode, Ashish ; Dongsheng Fan ; Spivak, Dmitry ; Camp, Janay ; Hong Xiao

  • Author_Institution
    GLOBALFOUNDRIES Inc., Malta, NY, USA
  • fYear
    2015
  • fDate
    3-6 May 2015
  • Firstpage
    351
  • Lastpage
    355
  • Abstract
    In this paper we evaluate the Reticle Defect Review feature on KLA-Tencor´s e-beam review tool, eDR™-7110, and study defect printability of reticle defects on wafer. The RDR feature is able to read KLA-Tencor´s reticle inspection results directly without any intermediate format, thus allowing what-you-see-is-what-you-get setup on the wafer review tool. Compared with a conventional reticle to wafer approach using KLA Results Files, Reticle Defect Review provides faster time to results, more accurate defect disposition and increased ease of use, which have been demonstrated by the printability study of reticle defects on a focus exposure matrix wafer.
  • Keywords
    inspection; reticles; defect printability; electron beam review tools; matrix wafer; printability study; reticle defect review feature; reticle inspection; wafer defect; Accuracy; Finite element analysis; Inspection; Manuals; Optical imaging; Software; R2W; defect printability; defect review; electron beam review; mask; reticle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • Type

    conf

  • DOI
    10.1109/ASMC.2015.7164418
  • Filename
    7164418