DocumentCode :
725091
Title :
Printability study of reticle defects on wafer using Reticle Defect Review on E-beam review tools
Author :
ChanSeob Cho ; Taylor, Ron ; Mungmode, Ashish ; Dongsheng Fan ; Spivak, Dmitry ; Camp, Janay ; Hong Xiao
Author_Institution :
GLOBALFOUNDRIES Inc., Malta, NY, USA
fYear :
2015
fDate :
3-6 May 2015
Firstpage :
351
Lastpage :
355
Abstract :
In this paper we evaluate the Reticle Defect Review feature on KLA-Tencor´s e-beam review tool, eDR™-7110, and study defect printability of reticle defects on wafer. The RDR feature is able to read KLA-Tencor´s reticle inspection results directly without any intermediate format, thus allowing what-you-see-is-what-you-get setup on the wafer review tool. Compared with a conventional reticle to wafer approach using KLA Results Files, Reticle Defect Review provides faster time to results, more accurate defect disposition and increased ease of use, which have been demonstrated by the printability study of reticle defects on a focus exposure matrix wafer.
Keywords :
inspection; reticles; defect printability; electron beam review tools; matrix wafer; printability study; reticle defect review feature; reticle inspection; wafer defect; Accuracy; Finite element analysis; Inspection; Manuals; Optical imaging; Software; R2W; defect printability; defect review; electron beam review; mask; reticle;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
Conference_Location :
Saratoga Springs, NY
Type :
conf
DOI :
10.1109/ASMC.2015.7164418
Filename :
7164418
Link To Document :
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