MEMS manufacturing solutions

Reducing time to market and cost-of-ownership is essential to MEMS makers. Therefore, lithography tools that continue to provide new, flexible, and versatile substrate alignment solutions, including backside alignment capabilities, are crucial factors in optimizing MEMS processes for faster production ramps. In order to determine the alignment technique that delivers optimal accuracy and throughput, it is necessary for MEMS manufacturers to be able to quickly evaluate a variety of front and backside alignment scenarios, and determine the best conditions for their specific MEMS processes. Various alignment methods available using Nikon MEMS steppers can achieve high overlay accuracy for non-EGA (Enhanced Global Alignment) applicable wafers, as well as for other substrates used in MEMS, LED, and ABS (air bearing surface) production. High overlay accuracy can also be achieved for applications that include exposure of both sides of the wafer such as MEMS and Power Devices. Newly developed Nikon MEMS Stepper alignment methods significantly enhance overlay optimization and performance capabilities, and contribute to reduction in MEMS time to market.