Particle free handling of substrates

Author

Samadi, Hassan ; Pfeffer, Markus ; Altmann, Roswitha ; Leibold, Andreas ; Gumprecht, Thomas ; Bauer, Anton

Author_Institution

Manuf. Control Group, Fraunhofer Insitute for Integrated Syst. & Device Technol. (IISB), Erlangen, Germany

fYear

2015

fDate

3-6 May 2015

Firstpage

367

Lastpage

371

Abstract

Semiconductor technology is heading towards the 10 nm node and even smaller in the coming years. This development relies not only on new process technologies, like lithography techniques, but also on safer and cleaner handling techniques that meet the high-end requirements of the production line. In this paper, the evaluation of different end-effectors and handling techniques regarding particle generation, organic and metallic contamination effects will be discussed. Bernoulli, carbon and standard vacuum end-effectors are being tested and compared with each other for the handling of 200 mm and 300 mm wafers.

Keywords

lithography; semiconductor technology; substrates; Bernoulli end-effector; carbon end-effector; lithography technique; metallic contamination effect; organic contamination effect; particle free handling technique; particle generation; process technology; production line; semiconductor technology; size 200 mm to 300 mm; substrate; vacuum end-effector; Aluminum; Atmospheric measurements; Carbon; Contamination; Manufacturing; Optical fiber devices; Standards; Bernoulli; carbon fiber; clean handling; metallic contamination; organic contamination; vacuum end-effector;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI

Conference_Location

Saratoga Springs, NY

Type

conf

DOI

10.1109/ASMC.2015.7164421

Filename

7164421