DocumentCode :
725107
Title :
300mm wafer level sulfur monolayer doping for III–V materials
Author :
Loh, W.-Y. ; Lee, R.T.P. ; Tieckelmann, R. ; Orzali, T. ; Sapp, B. ; Hobbs, C. ; Papa Rao, S.S. ; Fuse, K. ; Sato, M. ; Fujiwara, N. ; Chang, L. ; Uchida, H.
Author_Institution :
SEMATECH, Albany, NY, USA
fYear :
2015
fDate :
3-6 May 2015
Firstpage :
451
Lastpage :
454
Abstract :
We have demonstrated sulfur monolayer doping (MLD) of In(53%)GaAs on III-V buffer/Si substrate at 300mm wafer scale and obtained sheet resistance of 303 ohms/sq with 8% uniformity. Mono-layer doping was achieved via molecular doping of sulfur and conventional annealing for dopant drive-in. Chemical reactivity, cost, environmental, safety and health aspects (all of which are crucial for high volume manufacturing) were considered in the chemical down-selection. MLD demonstrates molecular-scale control with conformal, nondestructive introduction of dopants to III-V materials.
Keywords :
III-V semiconductors; annealing; elemental semiconductors; gallium arsenide; indium compounds; semiconductor doping; silicon; III-V materials; InGaAs; Si; annealing; chemical reactivity; dopant drive-in; molecular doping; sheet resistance; size 300 mm; wafer level sulfur monolayer doping; Annealing; Chemicals; Doping; Indium gallium arsenide; Junctions; Silicon; Monolayer Doping; Nanoscale; Shallow Junctions;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
Conference_Location :
Saratoga Springs, NY
Type :
conf
DOI :
10.1109/ASMC.2015.7164438
Filename :
7164438
Link To Document :
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