DocumentCode
725117
Title
Bridging the gap - integrating APC constraints and WIP flow optimization to enhance automated decision making in semiconductor manufacturing
Author
Stehli, Marcel ; Zschabitz, Daniel ; Jahnig, Thomas
Author_Institution
Manuf. Technol., GLOBALFOUNDRIES, Dresden, Germany
fYear
2015
fDate
3-6 May 2015
Firstpage
48
Lastpage
52
Abstract
Advanced process control (APC) is widely used in semiconductor manufacturing to adjust process parameters, ensuring a high product quality, while WIP flow optimization systems for scheduling & dispatching make decisions by assigning lots to tools for processing. APC imposes additional constraints to the operational decisions. It is critical to understand the relationship between these two aspects of the semiconductor manufacturing process in order to make better decisions for both. As this is a pressing and compelling topic for researchers and practitioners, this paper presents an integration approach that connects APC and WIP flow optimization systems, allowing APC aspects to be incorporated into scheduling & dispatching, in order to balance the conflict between product quality and operational objectives.
Keywords
decision making; dispatching; process control; scheduling; semiconductor device manufacture; APC constraint; WIP flow optimization system; advanced process control; automated decision making enhancement; dispatching; operational decision; scheduling; semiconductor manufacturing process; Context; Dispatching; Job shop scheduling; Manufacturing; Process control; Qualifications; APC; Dispatching; Scheduling; System Integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
Conference_Location
Saratoga Springs, NY
Type
conf
DOI
10.1109/ASMC.2015.7164449
Filename
7164449
Link To Document