• DocumentCode
    725117
  • Title

    Bridging the gap - integrating APC constraints and WIP flow optimization to enhance automated decision making in semiconductor manufacturing

  • Author

    Stehli, Marcel ; Zschabitz, Daniel ; Jahnig, Thomas

  • Author_Institution
    Manuf. Technol., GLOBALFOUNDRIES, Dresden, Germany
  • fYear
    2015
  • fDate
    3-6 May 2015
  • Firstpage
    48
  • Lastpage
    52
  • Abstract
    Advanced process control (APC) is widely used in semiconductor manufacturing to adjust process parameters, ensuring a high product quality, while WIP flow optimization systems for scheduling & dispatching make decisions by assigning lots to tools for processing. APC imposes additional constraints to the operational decisions. It is critical to understand the relationship between these two aspects of the semiconductor manufacturing process in order to make better decisions for both. As this is a pressing and compelling topic for researchers and practitioners, this paper presents an integration approach that connects APC and WIP flow optimization systems, allowing APC aspects to be incorporated into scheduling & dispatching, in order to balance the conflict between product quality and operational objectives.
  • Keywords
    decision making; dispatching; process control; scheduling; semiconductor device manufacture; APC constraint; WIP flow optimization system; advanced process control; automated decision making enhancement; dispatching; operational decision; scheduling; semiconductor manufacturing process; Context; Dispatching; Job shop scheduling; Manufacturing; Process control; Qualifications; APC; Dispatching; Scheduling; System Integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • Type

    conf

  • DOI
    10.1109/ASMC.2015.7164449
  • Filename
    7164449