Title :
Optical step height and trench depth measurement
Author :
Heider, Franz ; Janisch, Georg ; Kern, Michael ; Weinzierl, Kurt ; Troger, Bastian ; Meyer, Matthias
Author_Institution :
Infineon Technol., Villach, Austria
Abstract :
Optical profilometer measurements are contact-free and fast. The depth of single high-aspect-ratio trenches and the step height of opaque materials can be measured. Deep trenches (50-225 μm) are measured with a white light interferometer. Shallower trenches and step height profiles are measured with a chromatic white light sensor. A vertical resolution of 6 nm and a lateral resolution of 2 μm make the optical profilometer well suited for larger structures on power semiconductors that are manufactured in the back end of line.
Keywords :
height measurement; integrated circuit manufacture; integrated circuit measurement; light interferometry; surface topography measurement; chromatic white light sensor; contact free measurements; optical profilometer measurements; optical step height; trench depth measurement; white light interferometer; Joints; Light emitting diodes; Needles; Noise measurement; Optical reflection; Optical variables measurement; Probes;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2015.7164456