Quick process troubleshooting by using advanced SEM ADC system

Author

Hsieh, C.Y. ; Yang, C.C. ; Gao, S.C. ; Chen, Joe ; Chen, Wallas ; Chen, Henry ; Cheng, Alex

Author_Institution

Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan

fYear

2015

fDate

3-6 May 2015

Firstpage

209

Lastpage

211

Abstract

With shrinking design rules, the latest bare wafer surface inspection tools are driving sensitivity to less than 20nm. Fabs have also improved particle control-sometimes the biggest particle size is only ~30-50nm. KLA-Tencor´s SEM Review tool uses an improved alignment system and high sensitivity optical microscope (OM) to identify ~30nm particle. The review system also provides a real-time automatic defect classification system (RT-ADC) that is designed for in-line applications, offering real-time classification of defect types. Using RT-ADC, we can do fully automated bare wafer review and EDX, improving troubleshooting cycle time by 3.4X.

Keywords

X-ray chemical analysis; optical microscopes; scanning electron microscopy; semiconductor technology; EDX; KLA-Tencor; SEM review tool; optical microscope; real-time automatic defect classification system; size 30 nm to 50 nm; wafer surface inspection tools; Inspection; Manuals; Manufacturing; Real-time systems; Scanning electron microscopy; Sensitivity; Training; EDX; RT-ADC; SEM review; bare wafer review;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI

Conference_Location

Saratoga Springs, NY

Type

conf

DOI

10.1109/ASMC.2015.7164472

Filename

7164472