DocumentCode :
7257
Title :
Charge Collection Mechanisms in AlGaN/GaN MOS High Electron Mobility Transistors
Author :
Samsel, I.K. ; En Xia Zhang ; Hooten, N.C. ; Funkhouser, Erik D. ; Bennett, W.G. ; Reed, R.A. ; Schrimpf, R.D. ; McCurdy, Michael W. ; Fleetwood, D.M. ; Weller, Robert A. ; Vizkelethy, Gyorgy ; Xiao Sun ; Tso-Ping Ma ; Saadat, Omair I. ; Palacios, T.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
Volume :
60
Issue :
6
fYear :
2013
fDate :
Dec. 2013
Firstpage :
4439
Lastpage :
4445
Abstract :
Charge collection mechanisms in AlGaN/GaN MOS-HEMTs are investigated. Device types include those with no gate oxide, and those with HfO2 and Al2O3 gate oxides. Simultaneous charge collection is observed at the gate and the drain or the source, depending on strike location. Heavy ion data coupled with device simulations show that the introduction of a thin HfO2 layer in the gate stack introduces only a small valence band barrier, reducing but not preventing collection of holes at the gate in HfO2-gate devices. Furthermore, using Al2O3 gate oxide increases the valence band barrier over that of the HfO2, to the point where the radiation-induced transient is not detectable.
Keywords :
III-V semiconductors; MOSFET; alumina; gallium compounds; high electron mobility transistors; valence bands; wide band gap semiconductors; Al2O3; AlGaN-GaN; HfO2; MOS high electron mobility transistors; MOS-HEMT; charge collection mechanisms; device simulations; heavy ion data; small valence band barrier; Aluminum gallium nitride; Gallium nitride; HEMTs; Single event transients; Transient analysis; Aluminum gallium nitride (AlGaN); TCAD; charge collection; gallium nitride (GaN); high electron mobility transistor (HEMT); metal-oxide-semiconductor HEMT (MOS-HEMT); single-event transient;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2013.2289383
Filename :
6678277
Link To Document :
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