DocumentCode
7257
Title
Charge Collection Mechanisms in AlGaN/GaN MOS High Electron Mobility Transistors
Author
Samsel, I.K. ; En Xia Zhang ; Hooten, N.C. ; Funkhouser, Erik D. ; Bennett, W.G. ; Reed, R.A. ; Schrimpf, R.D. ; McCurdy, Michael W. ; Fleetwood, D.M. ; Weller, Robert A. ; Vizkelethy, Gyorgy ; Xiao Sun ; Tso-Ping Ma ; Saadat, Omair I. ; Palacios, T.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
Volume
60
Issue
6
fYear
2013
fDate
Dec. 2013
Firstpage
4439
Lastpage
4445
Abstract
Charge collection mechanisms in AlGaN/GaN MOS-HEMTs are investigated. Device types include those with no gate oxide, and those with HfO2 and Al2O3 gate oxides. Simultaneous charge collection is observed at the gate and the drain or the source, depending on strike location. Heavy ion data coupled with device simulations show that the introduction of a thin HfO2 layer in the gate stack introduces only a small valence band barrier, reducing but not preventing collection of holes at the gate in HfO2-gate devices. Furthermore, using Al2O3 gate oxide increases the valence band barrier over that of the HfO2, to the point where the radiation-induced transient is not detectable.
Keywords
III-V semiconductors; MOSFET; alumina; gallium compounds; high electron mobility transistors; valence bands; wide band gap semiconductors; Al2O3; AlGaN-GaN; HfO2; MOS high electron mobility transistors; MOS-HEMT; charge collection mechanisms; device simulations; heavy ion data; small valence band barrier; Aluminum gallium nitride; Gallium nitride; HEMTs; Single event transients; Transient analysis; Aluminum gallium nitride (AlGaN); TCAD; charge collection; gallium nitride (GaN); high electron mobility transistor (HEMT); metal-oxide-semiconductor HEMT (MOS-HEMT); single-event transient;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2013.2289383
Filename
6678277
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