DocumentCode :
725945
Title :
Ultra-compact G-band 16way power splitter/combiner module fabricated through a new method of 3D-copper additive manufacturing
Author :
Kazemi, H. ; Miller, D. ; Mohan, A. ; Jin, Y. ; Crawford, M. ; Wagenseil, M. ; Long, S.
Author_Institution :
Nuvotronics LLC, Camarillo, CA, USA
fYear :
2015
fDate :
17-22 May 2015
Firstpage :
1
Lastpage :
3
Abstract :
A new design and fabrication methodology for mmw and sub-mmw components is defined. The 3D copper additive manufacturing process is described with a full 3D volumetric 16 way splitter-combiner demonstration at G-band frequency range. The WR4 combiner is folded through design compaction and then sliced through its Z-direction and fabricated as slices to form a final 23 slice stack. The stack was then measured at 200-270 GHz using a WR4 test-through waveguide that traverses through the entire stack. The insertion loss measured at only 0.03 dB/mm showcasing its low loss characteristics. The 16 way splitter -combiner back to back was also tested using micro-machined WR4 through lines, fabricated and measured at an overall insertion loss of 4dB. The results highlight the success of the volumetric design in which a 16 way combiner measures <; 2dB insertion loss and occupies no more than 3.6 cm3 volume.
Keywords :
compaction; copper; micromachining; millimetre wave integrated circuits; power combiners; rapid prototyping (industrial); waveguides; 3D-copper additive manufacturing; Cu; WR4 combiner; WR4 test-through waveguide; Z-direction; design compaction; frequency 200 GHz to 270 GHz; full 3D volumetric 16 way splitter-combiner; loss 4 dB; micromachined WR4; slice stack; sub-mmw components; ultracompact G-band 16way power splitter-combiner; Computer aided manufacturing; Copper; Government; Manufacturing; Resists; Three-dimensional displays; G-band; Power amplifier; WR4; additive manufacturing; copper micromachining; power combiner; sub millimeter wave components; waveguide binary split;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium (IMS), 2015 IEEE MTT-S International
Conference_Location :
Phoenix, AZ
Type :
conf
DOI :
10.1109/MWSYM.2015.7166718
Filename :
7166718
Link To Document :
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