Title :
A low-cost broadband bondwire interconnect for THz heterogeneous system integration
Author :
Chun-Hsing Li ; Chih-Wei Lai ; Tzu-Chao Yan ; Chien-Nan Kuo
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Abstract :
A low-cost broadband bondwire interconnect is proposed for THz heterogeneous system integration. A transversal path composed of two transmission lines and a bondwire is introduced to effectively reduce the bondwire effect of an original signal path consisted of a single bondwire only. Simulation results indicate that the return loss and insertion loss can be better than 15 dB and 2.3 dB from dc to 456 GHz, respectively. Measured interconnect loss is around 0 dB to 1.5 dB from 320 to 340 GHz.
Keywords :
high-frequency transmission lines; lead bonding; radiofrequency interconnections; THz heterogeneous system integration; bondwire effect; frequency 320 GHz to 340 GHz; frequency 456 GHz; insertion loss; loss 0 dB to 1.5 dB; low-cost broadband bondwire interconnect; return loss; transmission lines; transversal path; Antennas; CMOS integrated circuits; CMOS technology; Detectors; Generators; Indexes; Bondwire; THz; broadband; heterogeneous integration; interconnect;
Conference_Titel :
Microwave Symposium (IMS), 2015 IEEE MTT-S International
Conference_Location :
Phoenix, AZ
DOI :
10.1109/MWSYM.2015.7166852
