DocumentCode :
726122
Title :
Commercialization of a reliable RF MEMS switch with integrated driver circuitry in a miniature QFN package for RF instrumentation applications
Author :
Goggin, Raymond ; Fitzgerald, Padraig ; Stenson, Bernard ; Carty, Eric ; McDaid, Padraig
Author_Institution :
Analog Devices, Cork, Ireland
fYear :
2015
fDate :
17-22 May 2015
Firstpage :
1
Lastpage :
4
Abstract :
This paper describes the commercialization of a reliable RF single pole four throw (SP4T) micro-electromechanical systems (MEMS) switch with integrated driver circuitry which is targeted at RF instrumentation applications. The integrated switch solution is mass produced in a high volume sub-micron semiconductor Class1 clean room manufacturing facility, fabricated on a low loss substrate and utilizes a wafer level silicon capping technology. This device achieves a low insertion loss of 0.52dB typical at 6GHz, a wide -3dB RF bandwidth of 11GHz to 14GHz and a minimum actuation lifetime of 1 billion cycles; and is presented in a small 5mm × 4mm × 0.95mm 24-pin quad flat no leads (QFN) plastic package. Topics discussed in the paper include the motivation for the development, fabrication, long term reliability and switch characteristics.
Keywords :
electronics packaging; microswitches; reliability; wafer level packaging; RF instrumentation applications; integrated driver circuitry; low loss substrate; miniature QFN package; quad flat no leads plastic package; reliable RF MEMS switch; single pole four throw MEMS switch; wafer level silicon capping technology; Commercialization; Instruments; Manufacturing; Micromechanical devices; Reliability; Silicon; Switches; Driver circuits; Microelectromechanical systems; Radiofrequency; Reliability; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium (IMS), 2015 IEEE MTT-S International
Conference_Location :
Phoenix, AZ
Type :
conf
DOI :
10.1109/MWSYM.2015.7166959
Filename :
7166959
Link To Document :
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