DocumentCode :
726214
Title :
A single-chain multiband reconfigurable linear power amplifier in SOI CMOS
Author :
Unha Kim ; Jung-Lin Woo ; Sunghwan Park ; Youngwoo Kwon
Author_Institution :
Sch. of EECS, Seoul Nat. Univ., Seoul, South Korea
fYear :
2015
fDate :
17-22 May 2015
Firstpage :
1
Lastpage :
4
Abstract :
A multiband linear CMOS power amplifier (PA) is developed to cover multiple LTE bands from 800 to 2000 MHz using a single PA core. The single-chain PA is based on a two-stage design using stacked-FET cells, and is designed to support any combinations of low/high dual bands out of five popular 3G/4G bands (Band 1/2/4/5/8). To avoid the performance degradation by covering such a wide bandwidth using a single PA-core, the frequency reconfigurability has been applied to the stacked-FET cells, interstage matching as well as the output matching. To further enhance the linearity and efficiency, a phase-based linearizer is employed and reconfigured according to the operating frequencies. W-CDMA test on the fabricated PA shows adjacent channel leakage ratios (ACLRs) better than -39 dBc up to the rated linear power of 28.5 dBm and power-added efficiencies (PAEs) higher than 40.7% and 46% for high- and low- frequency band groups, respectively. Compared with the dedicated PAs using the same process, PAE degradation is limited to 1.6 ~ 3.3%. To our knowledge, this work is among the best results from the single-chain PAs for 3G/4G mobile applications.
Keywords :
CMOS integrated circuits; adjacent channel interference; power amplifiers; silicon-on-insulator; SOI CMOS; adjacent channel leakage ratios; interstage matching; multiband linear CMOS power amplifier; phase-based linearizer; single-chain multiband reconfigurable linear power amplifier; stacked-FET cells; CMOS integrated circuits; Indexes; Logic gates; PHEMTs; RNA; CMOS; LTE; SOI; W-CDMA; envelope injection; linearization; multiband; power amplifier (PA); reconfigurable; stacked-FET;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium (IMS), 2015 IEEE MTT-S International
Conference_Location :
Phoenix, AZ
Type :
conf
DOI :
10.1109/MWSYM.2015.7167086
Filename :
7167086
Link To Document :
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