Inkjet-printed trisection bandpass filter on multilayer liquid crystal polymer substrate

Author

Hsuan-ling Kao ; Cheng-Lin Cho ; Li-Chun Chang ; Yung-Hsien Wu

Author_Institution

Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan

fYear

2015

fDate

17-22 May 2015

Firstpage

1

Lastpage

4

Abstract

This paper presents a inkjet-printed trisection bandpass filter on multilayer LCP, which was developed based on mechanical property of inkjet-printed silver film. A lamination bonding pressure of 0.69 MPa and temperature of 270 °C were used to achieve appropriate adhesiveness. A filter was realized with a S₂₁ of -1.06 at 10.5 GHz. The bending effect was also observed. The results demonstrated the success of the fabrication technique provides an inexpensive and practicable 3D integration solution.

Keywords

band-pass filters; bonding processes; ink jet printers; laminations; liquid crystal polymers; microwave filters; silver; 3D integration solution; Ag; bending effect; frequency 10.5 GHz; inkjet-printed silver film; inkjet-printed trisection bandpass filter; lamination bonding; mechanical property; multilayer liquid crystal polymer substrate; pressure 0.69 MPa; temperature 270 degC; Extraterrestrial measurements; Fabrication; Lamination; Microwave filters; Nonhomogeneous media; Radio frequency; Inkjet printing; multilayer liquid crystal polymer; trisection bandpass filter;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium (IMS), 2015 IEEE MTT-S International

Conference_Location

Phoenix, AZ

Type

conf

DOI

10.1109/MWSYM.2015.7167110

Filename

7167110