DocumentCode :
726450
Title :
Thermal constrained resource management for mixed ILP-TLP workloads in dark silicon chips
Author :
Khdr, Heba ; Pagani, Santiago ; Shafique, Muhammad ; Henkel, Jorg
Author_Institution :
Embedded Syst. (CES), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
fYear :
2015
fDate :
8-12 June 2015
Firstpage :
1
Lastpage :
6
Abstract :
In dark silicon chips, a significant amount of on-chip resources cannot be simultaneously powered on and need to stay dark, i.e., power gated, in order to avoid thermal emergencies. This paper presents a resource management technique, called DsRem, that selects the number of active cores jointly with their voltage/frequency (v/f) levels, considering the high Instruction Level Parallelism (ILP) or Thread Level Parallelism (TLP) nature of different applications, in order to maximize the overall system performance. DsRem leverages the positioning of dark cores, to efficiently dissipate the heat generated by the active cores. This facilitates increasing the v/f level of the active cores, which leads to further performance improvement. Compared to state-of-the-art thermal-aware task application mapping, DsRem achieves up to 46% performance gain, while avoiding any thermal emergencies. Additionally, DsRem outperforms the boosting technique with 26%.
Keywords :
integrated circuit design; logic design; microprocessor chips; processor scheduling; resource allocation; thermal management (packaging); DsRem management technique; active core heat generation; active core selection; dark silicon chips; instruction level parallelism; mixed ILP-TLP workloads; on-chip resources; power gated operation; resource management technique; thermal aware task application mapping; thermal constrained resource management; thread level parallelism; Heating; Mathematical model; Power demand; Resource management; Silicon; Thermal management; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (DAC), 2015 52nd ACM/EDAC/IEEE
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1145/2744769.2744916
Filename :
7167365
Link To Document :
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