• DocumentCode
    726451
  • Title

    Hayat: Harnessing Dark Silicon and variability for aging deceleration and balancing

  • Author

    Gnad, Dennis ; Shafique, Muhammad ; Kriebel, Florian ; Rehman, Semeen ; Duo Sun ; Henkel, Jorg

  • Author_Institution
    Embedded Syst., Karlsruhe Inst. of Technol., Karlsruhe, Germany
  • fYear
    2015
  • fDate
    8-12 June 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Elevated power densities result in the so-called Dark Silicon constraint that prohibits simultaneous activation of all the cores in an on-chip system (in the full performance mode) to respect the safe thermal limits, thus enforcing a significant amount of on-chip resources to stay `dark´ (i.e., power-gated). In this paper, we show that how Dark Silicon together with the manufacturing process induced variability can be harnessed to mitigate reliability threats in the nano-era. In particular, we propose a run-time system Hayat* that harnesses Dark Silicon to decelerate and/or balance temperature-dependent aging, while also considering variability in order to improve the overall system performance for a given lifetime. Experimental evaluation across a range of chips to account for process variations illustrates that our Hayat system can provide a significant aging/performance improvement and decelerates the chip aging by 6 months - 5 years (depending upon the required lifetime constraint) compared to state-of-the-art techniques.
  • Keywords
    ageing; elemental semiconductors; integrated circuit manufacture; integrated circuit reliability; nanoelectronics; silicon; Hayat run-time system; Si; aging deceleration; chip aging; dark silicon constraint; lifetime constraint; manufacturing process; nanoera; on-chip resources; on-chip system; power densities; reliability threats; temperature-dependent aging; time 6 month to 5 year; Aging; Degradation; Estimation; Optimization; Silicon; Steady-state; Throughput; Aging; Dark Silicon; Multi-Core; Optimization; Process Variations; Reliability; Soft Error; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2015 52nd ACM/EDAC/IEEE
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1145/2744769.2744849
  • Filename
    7167366