DocumentCode :
726562
Title :
SPICE-compatible high frequency physical modeling approach for an inductor
Author :
Taki, J. ; Bensetti, M. ; Sadarnac, D.
Author_Institution :
GeePs | Group of Electr. Eng. - Paris, Univ. Paris-Sud, Gif-sur-Yvette, France
fYear :
2015
fDate :
1-5 June 2015
Firstpage :
176
Lastpage :
181
Abstract :
Multi-physics modeling in power electronics contains EMC studies, thus conception requires modeling of passive elements. These models need to be compatible with the simulation software usually used in the industry. An analysis for modeling an inductor at high-frequency is presented in this study. The method takes into account the proper inductances of the turns, the mutual inductances between them, the parasitic capacitances, and the resistance of the windings. The originality of the model is that it is based on physical geometries and the material characteristics of the inductor and covers a large frequency bandwidth. These elements are used to create an analytical model based on electrical equations in order to provide the frequency dependent impedance of the inductor. The model is validated using experimental measurements.
Keywords :
SPICE; capacitance; electric resistance; electromagnetic compatibility; inductance; inductors; power electronics; windings; EMC; SPICE-compatible high frequency physical modeling approach; frequency bandwidth; frequency dependent impedance; inductor; multiphysics modeling; mutual inductance; parasitic capacitance; passive element modelling; power electronics; winding resistance; Capacitance; Frequency measurement; Inductors; Mathematical model; Resistance; Resonant frequency; Solenoids; EMC; High Frequency; Physical Modeling of Inductor; SPICE;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and ECCE Asia (ICPE-ECCE Asia), 2015 9th International Conference on
Conference_Location :
Seoul
Type :
conf
DOI :
10.1109/ICPE.2015.7167783
Filename :
7167783
Link To Document :
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