DocumentCode :
726565
Title :
Modeling and analysis of conducted EMI for a modular multilevel converter
Author :
Zhang Bin ; Chen Wenjie ; Huang Lang ; Zhang Jiao ; Yang Xu
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2015
fDate :
1-5 June 2015
Firstpage :
268
Lastpage :
273
Abstract :
Currently, the modular multilevel converters (MMCs) based high voltage direct current (HVDC) transmission system have been widely applied due to its better characteristics, such as the stringent modular structure and good line-side behavior. This paper studies the conducted common mode electromagnetic interference (EMI) in MMC based HVDC system. As a matter of fact, interference sources are very complicated for large amounts of switches in large scale MMCs. This paper proposed a novel EMI model of MMC for the first time. Based upon that model, the influence of parasitic parameters of switches, the voltages stage of direct current side and the switching frequency on the leakage current are studied in detail. Useful information about the distribution of conducted interference both in time domain and in frequency domain can be acquired from the proposed model. Theoretical analysis and simulations demonstrated the proposed EMI model provides an intensively investigation and discussion for the conducted EMI in MMC based HVDC system.
Keywords :
HVDC power convertors; electromagnetic interference; frequency-domain analysis; time-domain analysis; HVDC transmission system; MMC system; conducted EMI; conducted common mode electromagnetic interference; direct current side; high voltage direct current transmission system; interference sources; modular multilevel converter; switches parasitic parameters influence; voltages stage; Capacitors; Electromagnetic interference; Frequency-domain analysis; HVDC transmission; Leakage currents; Switching frequency; Time-domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and ECCE Asia (ICPE-ECCE Asia), 2015 9th International Conference on
Conference_Location :
Seoul
Type :
conf
DOI :
10.1109/ICPE.2015.7167797
Filename :
7167797
Link To Document :
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