Solution-Deposited Carbon Nanotube Flip Chip Interconnect for High-Frequency Applications

Author

Pingye Xu ; Hamilton, Michael C.

Author_Institution

Dept. of Electr. & Comput. Eng., Auburn Univ., Auburn, AL, USA

Volume

25

Issue

4

fYear

2015

fDate

Apr-15

Firstpage

229

Lastpage

231

Abstract

A coplanar waveguide (CPW) structure with carbon nanotube bumps as flip chip interconnects is presented. The carbon nanotube (CNT) interconnects are fabricated using a solution-based method. This work shows the feasibility of using solution-deposited CNTs as flip chip interconnects and presents their high frequency characteristics in comparison to similarly-sized gold interconnects. The solution-deposited CNT interconnects have similar resistance to transferred CNT bumps grown by chemical vapor deposition. The fabricated CNT bumps are well shaped and have an average dc resistance of 970 mΩ ( 150 μm in diameter and 10 μm in height). High frequency characterization was carried out up to 40 GHz. The return loss is better than 15 dB and the insertion loss of the CNT interconnect is 0.3 dB higher than conventional gold bump interconnects per transition.

Keywords

carbon nanotubes; coplanar waveguides; flip-chip devices; integrated circuit interconnections; liquid phase deposition; C; carbon nanotube bumps; carbon nanotube flip chip interconnect; coplanar waveguide structure; high-frequency applications; insertion loss; return loss; solution deposition; Carbon nanotubes; Coplanar waveguides; Electrical resistance measurement; Flip-chip devices; Gold; Integrated circuit interconnections; Resistance; Carbon nanotube (CNT); coplanar waveguide (CPW); flip chip interconnect; solution deposition;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2015.2400926

Filename

7045619