• DocumentCode
    728320
  • Title

    Integrated design of mechanism and control for high-precision stages by the interaction index in the Direct Nyquist Array method

  • Author

    Ohnishi, Wataru ; Fujimoto, Hiroshi ; Sakata, Koichi ; Suzuki, Kazuhiro ; Saiki, Kazuaki

  • Author_Institution
    Univ. of Tokyo, Kashiwa, Japan
  • fYear
    2015
  • fDate
    1-3 July 2015
  • Firstpage
    2825
  • Lastpage
    2830
  • Abstract
    High-precision stages are widely used in the semiconductor and flat panel industry. Because these stages have six degrees of freedom to control, coupling forces can deteriorate its control performance and stability. If heights of the center of gravity (CoG), the center of rotation (CoR), the actuation point, and the measurement point are not the same, couping between the x and θy motions occurs. In this paper, integrated design method of mechanism and control is proposed utilizing the Direct Nyquist Array (DNA) method and a changeable actuation height stage by means of multiple actuator arrangement in the x direction. Due to the model analysis and the optimal actuation height, the coupling can be reduced with a simple precompensator. By drawing the Generalized Gershgorin Band (GGB), the effectiveness of the proposed method is verified through experiments.
  • Keywords
    Nyquist stability; actuators; control system synthesis; flat panel displays; precision engineering; semiconductor industry; DNA method; GGB; actuation point; center of gravity; center of rotation; changeable actuation height stage; control performance; coupling forces; direct Nyquist array method; flat panel industry; generalized Gershgorin band; high-precision stages; integrated design method; measurement point; multiple actuator arrangement; optimal actuation height; semiconductor industry; stability; Actuators; Adaptive control; Couplings; DNA; Gravity; Indexes; Transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    American Control Conference (ACC), 2015
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4799-8685-9
  • Type

    conf

  • DOI
    10.1109/ACC.2015.7171163
  • Filename
    7171163