• DocumentCode
    728344
  • Title

    Compact modeling and system implications of microring modulators in nanophotonic interconnects

  • Author

    Rui Wu ; Chin-Hui Chen ; Fedeli, Jean-Marc ; Fournier, Maryse ; Beausoleil, Raymond G. ; Kwang-Ting Cheng

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, Santa Barbara, CA, USA
  • fYear
    2015
  • fDate
    6-6 June 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Silicon microring modulators are critical components in optical on-chip communications. In this paper, we develop theoretical compact models for optical transmission, power consumption, bit-error-rate (BER), and electrical tuning of microring modulators. The proposed theoretical models have been extensively validated by fabricated devices from a number of designs and fabrication batches. Since the quality factor (Q) and the extinction ratio (ER) of the microring modulator are important to determine the BER and link power budget, we include accurate equations for the Q and the ER in our models. Based on the proposed models, we identify an extra power penalty for the electrical tuning, and an energy-efficient swing voltage for the microring modulator to achieve to minimum total energy consumption.
  • Keywords
    Q-factor; error statistics; modulators; nanophotonics; optical interconnections; power consumption; BER; bit-error-rate; electrical tuning; energy-efficient swing voltage; extinction ratio; extra power penalty; fabricated devices; link power budget; minimum total energy consumption; nanophotonic interconnects; optical on-chip communications; optical transmission; power consumption; quality factor; silicon microring modulators; theoretical compact models; Bit error rate; Erbium; Mathematical model; Optical device fabrication; Optical modulation; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Level Interconnect Prediction (SLIP), 2015 ACM/IEEE International Workshop on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/SLIP.2015.7171708
  • Filename
    7171708