• DocumentCode
    728701
  • Title

    Vibration characteristic analysis of a piezoelectric transducer using first bending vibration modes

  • Author

    Zhaoyang Yu ; Yingxiang Liu ; Dongmei Xu ; Junkao Liu ; Weishan Chen

  • Author_Institution
    State Key Lab. of Robot. & Syst., Harbin Inst. of Technol., Harbin, China
  • fYear
    2015
  • fDate
    24-27 May 2015
  • Firstpage
    32
  • Lastpage
    35
  • Abstract
    A piezoelectric transducer using first bending vibration modes is proposed in this paper; it can be used as a stator for an ultrasonic motor. The transducer has a symmetrical structure, in which a conical horn is located at one end. On the tip of the horn, a cylindrical driving foot is machined. Bending vibrations are superimposed in the transducer to generate elliptical trajectory movement at the driving foot. The working principle of the proposed transducer is analyzed. The resonant frequencies and the electromechanical coupling factor of the bending modes are analyzed under different structural parameters. An improved structure for the initial model is proposed. The motion trajectory of the driving foot is obtained by transient analysis. The results can be a theoretical guidance for the design of piezoelectric actuator using bending transducer.
  • Keywords
    piezoelectric transducers; stators; transient analysis; ultrasonic motors; vibrations; conical horn; cylindrical driving foot; electromechanical coupling factor; elliptical trajectory movement; first bending vibration modes; piezoelectric transducer; stator; transient analysis; ultrasonic motor; vibration characteristic analysis; Acoustics; Ceramics; Couplings; Metals; Resonant frequency; Transducers; Vibrations; bending vibration; electromechanical coupling factor; piezoelectric transducer; resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectric, International Symposium on Integrated Functionalities and Piezoelectric Force Microscopy Workshop (ISAF/ISIF/PFM), 2015 Joint IEEE International Symposium on the
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/ISAF.2015.7172661
  • Filename
    7172661