DocumentCode :
728733
Title :
Advanced processing of lead titanate-polyimide composites for high temperature piezoelectric sensing
Author :
Khanbareh, H. ; Hegde, M. ; van der Zwaag, S. ; Groen, W.A.
Author_Institution :
Mater. Innovation Inst. (M2i), Delft, Netherlands
fYear :
2015
fDate :
24-27 May 2015
Firstpage :
265
Lastpage :
267
Abstract :
High performance polymer-ceramic composites are presented as promising candidates for high temperature piezoelectric sensing applications. lead-titanate (PT) ceramic particulate is incorporated into a polyetherimide polymer matrix, (PEI) at a specific volume fraction of 20% in the forms of 0-3 and quasi 1-3. A conventional dielectrophoretic structuring is used to induce chain like particle configuration, followed by curing the matrix to form free standing films. Poling process is perfomed at temperatures above the Tg of the partially imidized matrix and under high voltages subsequently. Free standing composites are imidized at 200 °C and 300 °C to form fully imidized films. The poled particulate composites tend to retain the original piezoelectric properties upon fully imidization. The structured composites show enhanced dielectric and piezoelectric properties compared to 0-3 composites.
Keywords :
electrophoresis; filled polymers; lead compounds; piezoceramics; piezoelectricity; PbTiO3; advanced processing; chain like particle configuration; dielectrophoretic structuring; free standing films; high temperature piezoelectric sensing; lead titanate-polyimide composites; lead-titanate ceramic particulate; poling process; polyetherimide polymer matrix; polymer-ceramic composites; temperature 200 degC; temperature 300 degC; Ceramics; Dielectrophoresis; Films; Lead; Polyimides; Temperature; Piezoelectric composites; dielectrophoresis; high temperature polyetherimides;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectric, International Symposium on Integrated Functionalities and Piezoelectric Force Microscopy Workshop (ISAF/ISIF/PFM), 2015 Joint IEEE International Symposium on the
Conference_Location :
Singapore
Type :
conf
DOI :
10.1109/ISAF.2015.7172722
Filename :
7172722
Link To Document :
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