Combine partial EBG structure and Z-shape power bus for noise isolation in multi-layer PCBs

The ground bounce noise (GBN) in high-integrative and high-complexity circuit designs is discussed in this paper. GBN doesn´t only transmit its own power and ground plane but also couple to power and ground plane nearby. Therefore, power integrity (PI) will be affected by GBN. I use the segmentation method to cut off the cavity model of PCB. Here, I embed partial electromagnetic bandgap (EBG) structure and Z-shape power bus to isolate the noise power and ground planes. Then, partial EBG structure and Z-shape power bus are implanted to form stop-band characteristics. We can find noise isolation has the same effect as the period EBG structure. Through this modelling method, we can separate the stop-band and pass-band in Z-shape and EBG individually. In the model, the PCB is divided into five segments of different sizes and rectangular power and ground plane. Through the mushroom-shape (Mushroom-like) EBG, these structures are connected as part of a vertical blind hole, rectangular resonant cavity and the transmission line model to describe the Z-shape power bus. From practices and proposed methods, we can effectively improve result of isolating the power and ground noise simulation and implement.