New integrated workflow for EMI simulation

The purpose of this study is to predict electromagnetic interference (EMI) using circuit simulation integration with 2.5-D and 3-D full-wave, electromagnetic (EM) field solvers. These simulations predict the electronic system performance using signal integrity (SI), power integrity (PI) and far field radiation metrics while incorporating the entire system virtually. SPICE, IBIS, PCB layout, Connectors, and 3-D enclosures are all included within the virtual system to accurately predict system performance. The study presented in this paper shows how to simulate EMI in a complex high-speed I/O system in the time- and frequency-domains using the virtual 3-D enclosure by dynamically linking ANSYS SIwave, a specialized design platform for SI, PI and EMI analysis of electronic packages and PCBs including circuit analysis and ANSYS HFSS, a full-wave EM tool. The concepts shown in this paper can be applied to any kind of high-speed I/O system.