Title :
Near-field injection at die level
Author :
Boyer, A. ; Vrignon, B. ; Shepherd, J.
Author_Institution :
LAAS, Toulouse, France
Abstract :
Near-field injection is a promising method in order to induce local faults in integrated circuits. This paper aims at proposing a model of the coupling between the injection probe and the circuit under test. This study relies on measurements performed on a test chip by on-chip voltage sensors.
Keywords :
integrated circuit modelling; integrated circuit testing; circuit under test; die level; injection probe; integrated circuits; local faults; near-field injection; on-chip voltage sensors; test chip; Couplings; Integrated circuit modeling; Magnetic fields; Probes; Voltage measurement; Wires;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4799-6668-4
DOI :
10.1109/APEMC.2015.7175281
