DocumentCode
729101
Title
Electromagnetic interference measurement study in BGA package
Author
Meng-Hua Tu ; Ren-Fang Hsu ; Sung-Mao Wu ; Cheng-Chang Chen
Author_Institution
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear
2015
fDate
26-29 May 2015
Firstpage
219
Lastpage
222
Abstract
IC-EMC has been taken care and developed on the decade. Some standards about EMC and radiated emission were stipulated. However, in integrated circuits, no rules or specified information can support the method of EMC suppression. According to the EMC standard, this paper proposed the radiated emission measurement of different bonding type in the integrated circuit and different substrate design with BGA package and the method of EMC suppression.
Keywords
ball grid arrays; electromagnetic compatibility; electromagnetic interference; BGA package; EMC suppression; IC-EMC; electromagnetic interference measurement; radiated emission measurement; Bonding; Electromagnetic compatibility; Electromagnetic interference; Power transmission lines; Standards; Substrates; Transmission line measurements; BGA Substrate package; Bonding; IC-EMC; Radiated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4799-6668-4
Type
conf
DOI
10.1109/APEMC.2015.7175315
Filename
7175315
Link To Document