Title :
Electromagnetic interference measurement study in BGA package
Author :
Meng-Hua Tu ; Ren-Fang Hsu ; Sung-Mao Wu ; Cheng-Chang Chen
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
Abstract :
IC-EMC has been taken care and developed on the decade. Some standards about EMC and radiated emission were stipulated. However, in integrated circuits, no rules or specified information can support the method of EMC suppression. According to the EMC standard, this paper proposed the radiated emission measurement of different bonding type in the integrated circuit and different substrate design with BGA package and the method of EMC suppression.
Keywords :
ball grid arrays; electromagnetic compatibility; electromagnetic interference; BGA package; EMC suppression; IC-EMC; electromagnetic interference measurement; radiated emission measurement; Bonding; Electromagnetic compatibility; Electromagnetic interference; Power transmission lines; Standards; Substrates; Transmission line measurements; BGA Substrate package; Bonding; IC-EMC; Radiated emission;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4799-6668-4
DOI :
10.1109/APEMC.2015.7175315
