DocumentCode :
729129
Title :
System level interconnect electrical performance characterization
Author :
Su, Thonas ; Hsu, Jimmy ; Kai Xiao ; Li, Y.L.
Author_Institution :
DEG, Intel Microelectron. Asia Ltd., Taipei, Taiwan
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
12
Lastpage :
15
Abstract :
In PC/Server industry, simulation process is usually separated into pre-layout and post-layout phase. The pre-layout simulation focus in finding the solution space or choosing a better topology [1], [2]. For post-layout simulation, extracting 3 or 5 pairs of the channel model and conducting the simulation analysis is widely used. However, it requires a basic understanding of the layout. Otherwise the channel which is extracted may not be the best one to represent the worst scenario in the reality. The system level interconnect electrical performance characterization, which can consider a whole interface or even multiple interfaces, become an efficient way, especially estimating the risk of an out-of-guideline design. In this paper, a process with less human interaction is demonstrated. This method can relief the burden in choosing the representative channel from the layout and allow the designer to focus in improving the layout quality in these problematic areas.
Keywords :
integrated circuit interconnections; integrated circuit layout; PC/Server industry; human interaction; layout quality; out-of-guideline design; post-layout simulation; pre-layout simulation; representative channel; simulation analysis; system level interconnect electrical performance characterization; Couplings; Crosstalk; Delay effects; Frequency-domain analysis; Layout; Servers; Time-domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4799-6668-4
Type :
conf
DOI :
10.1109/APEMC.2015.7175350
Filename :
7175350
Link To Document :
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