• DocumentCode
    729244
  • Title

    Proposal of 0.13um new structure LDMOS for automotive PMIC

  • Author

    Kwangsik Ko ; Joowon Park ; Jina Eum ; Kuemju Lee ; Sanghyun Lee ; Jaehee Lee

  • Author_Institution
    Syst. IC Div., SK hynix Inc., Cheongju, South Korea
  • fYear
    2015
  • fDate
    21-24 June 2015
  • Firstpage
    119
  • Lastpage
    120
  • Abstract
    Summary form only given. In this paper we studied 90V high-side LDMOS and 50V fully isolated LDMOS with double epi structure and also found the method of increasing thermal stability to meet requirements above mentioned. The 90V high-side LDMOS used normally in buck-boost circuit need high BVdss over 110V. This high BV dss can obtain by thicker Epi scheme but increasing Epi thickness should cause the difficulty of electrical connecting drain node to n+ buried layer (NBL-l) by implantation. So, this is the major reason to introduce the double Epi scheme instead of the conventional single Epi scheme. And we modified PBL doping concentration by slicing PBL structure to obtain maximized RESURF effect to more get high BVdss without changing doping concentration ofPBL (p+ buried layer). And we also increased BVdss by putting floated poly on STI oxide that can induce the voltage coupling of drain bias, which gradually reduce electric field concentrated under STI.
  • Keywords
    CMOS integrated circuits; automotive electronics; buried layers; electric fields; power integrated circuits; semiconductor doping; LDMOS; NBL-l; PBL doping concentration; PBL structure; RESURF effect; STI oxide; automotive PMIC; buck-boost circuit; double epi scheme; double epi structure; drain bias; drain node; electric field; epi thickness; lateral double diffused MOS; n+ buried layer; p+ buried layer; power management IC; thermal stability; voltage 50 V; voltage 90 V; voltage coupling; Semiconductor optical amplifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2015 73rd Annual
  • Conference_Location
    Columbus, OH
  • Print_ISBN
    978-1-4673-8134-5
  • Type

    conf

  • DOI
    10.1109/DRC.2015.7175584
  • Filename
    7175584