• DocumentCode
    72959
  • Title

    Silica aerogel thick film, an alternative to micromachined air gap for thermal insulation

  • Author

    Seyedjalali, M. ; Madani, M.R.

  • Author_Institution
    Center for Adv. Comput. Studies, Univ. of Louisiana at Lafayette, Lafayette, LA, USA
  • Volume
    51
  • Issue
    11
  • fYear
    2015
  • fDate
    5 28 2015
  • Firstpage
    849
  • Lastpage
    850
  • Abstract
    A uniform, smooth and crack-free multilayer silica aerogel film as thick as 5 μm is successfully coated on top of a silicon wafer. The multilayer spin-coated aerogel film was made possible by using the present authors´ recently developed novel state-of-the-art aerogel processing technique. The utilisation of the thick aerogel film for the thermal insulation of a microhotplate (μHP) is studied. The super heat insulator aerogel can replace the micromachined air cavity conventionally created under μHPs for the fabrication of metal oxide gas sensors. The thermal insulation capability of the unique aerogel film was investigated by measuring the temperature of the nichrome heaters built on the aerogel coated silicon wafers at different applied powers. The temperature coefficient of the resistivity of the heaters was measured by monitoring the change in the resistance of the heaters at different temperatures. Simulations were also performed using COMSOL multiphysics software for verification of the experimental results, showing good agreement.
  • Keywords
    aerogels; gas sensors; microfabrication; microsensors; silicon compounds; spin coating; temperature measurement; temperature sensors; thermal insulating materials; thermal insulation; thick film sensors; μHP; COMSOL multiphysics software; MOX gas sensor; SiO; aerogel processing technique; crack-free multilayer silica aerogel thick film; metal oxide gas sensor; microhot-plate; micromachined air gap; multilayer spin coated aerogel; nichrome heater; super heat insulator aerogel; temperature measurement; thermal insulation;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2015.0088
  • Filename
    7110760