LED encapsulation and integration with Film Assisted Molding technology

Single LED package based on encapsulated leadframe provides a common electrical and thermal path with dramatic reduction of its thermal resistance. The specific LED packaging technology consists of a silver plated copper leadframe overmolded with a reflective white compound. This paper presents low cost molding process to mold the leadframe with bleed/flash free. With single/double films lining of the molded parts, film assisted transfer molding technology(FAM) provides easy release of the compound from the mold and keeps specific surfaces clear from the molding compound. The LED module based on the leadframe encapsulation and LED system wafer level integration can be easily reached with low cost by FAM technology to keep certain LED surfaces and sensor clear.