The application and the mechanism of particle heat radiating based on the near field resonance

The LED heat transfer coefficient of the heat conductivity adhesive is always lower, and it can not be improved obviously even if doping more high thermal conductivity particles the coefficient of adhesive. The article puts forward that the near field resonance mechanism concerned surface wave energy level can be used in the thermal conductivity of adhesive, mainly to use a close match with particle surface level (electromagnetic energy level) and thermal excitation energy of the room temperature( KBT), to generate a strong near field effect in particle surface, to do Surface Modification Treatment to SiC with the good thermal conductivity and insulation materials. Using the surface wave to effect nanoscale particles with the high thermal conductivity, then evenly being distributed into polymer glue, it can get more bonding performance but lower coefficient of thermal conductivity. It can well improve the heat conduction performance of the colloid, and can develop encapsulation materials being the higher thermal conductivity coefficient.