• DocumentCode
    730020
  • Title

    Determination of the aging offset voltage of AMR sensors based on accelerated degradation test

  • Author

    Zambrano, Andreina ; Kerkhoff, Hans G.

  • Author_Institution
    Testable Design Test of Integrated Syst., Univ. of Twente, Enschede, Netherlands
  • fYear
    2015
  • fDate
    24-26 June 2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Usually Anisotropic Magnetoresistance angle sensors are configured with two Wheatstone bridges, but an undesirable offset voltage included in the sensor output affects its accuracy. The total offset voltage combines a voltage due to resistance mismatches during manufacturing and a voltage from inequalities in the magnetic sensitivity. This paper focuses on identifying a consistent trend between the bridges´ offset voltages. Compared with previous studies that focus on lifetime tests using high temperatures, this research uses temperature cycling to study offset voltage and sensitivity variations due to aging effects. A consistent trend between the bridges´ offset voltages could not be found. The two offset components can add to or subtract from each other and their interaction can change over time due to variations in the sensor´s material properties. To achieve a precise angle measurement, the offset voltage must be compensated continuously over the entire sensor lifetime.
  • Keywords
    angular measurement; enhanced magnetoresistance; life testing; magnetic field measurement; magnetic sensors; magnetoresistive devices; voltage measurement; AMR angle sensor; Wheatstone bridge; accelerated degradation testing; aging offset voltage determination; angle measurement; anisotropic magnetoresistance angle sensor; magnetic sensitivity; Bridge circuits; Degradation; Magnetic sensors; Temperature measurement; Temperature sensors; Voltage measurement; AMR angle sensor; degradation test; offset voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed-Signal Testing Workshop (IMSTW), 2015 20th International
  • Conference_Location
    Paris
  • Type

    conf

  • DOI
    10.1109/IMS3TW.2015.7177871
  • Filename
    7177871