• DocumentCode
    73087
  • Title

    Novel Differential-Mode Equalizer With Broadband Common-Mode Filtering for Gb/s Differential-Signal Transmission

  • Author

    Yu-Jen Cheng ; Hao-Hsiang Chuang ; Chung-kuan Cheng ; Tzong-Lin Wu

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    3
  • Issue
    9
  • fYear
    2013
  • fDate
    Sept. 2013
  • Firstpage
    1578
  • Lastpage
    1587
  • Abstract
    In high-speed differential signal transmission, signal integrity at the receiving end is mainly determined by high quality of the differential-mode signal and good suppression of the common-mode noise. In this paper, an innovative circuit with dual function of the differential-mode equalizer and common-mode filter (DME-CMF) is proposed. The differential-mode and common-mode characteristics of the proposed structure are discussed separately with their corresponding half-circuit model. Based on the proposed design methodology for the DME-CMF and the presented structure realizing the DME-CMF with a two-layer printed circuit board, a set of design parameters are determined for 8-Gb/s differential transmission and utilized in the fabrication of test boards. The frequency-domain and time-domain measurements of the test board successfully demonstrate the effectiveness of the proposed structure.
  • Keywords
    circuit noise; equalisers; equivalent circuits; filters; printed circuits; DME-CMF; bit rate 8 Gbit/s; broadband common mode filtering; common mode noise; differential mode equalizer; differential signal transmission; frequency-domain measurements; half-circuit model; signal integrity; test boards; time-domain measurements; two-layer printed circuit board; Attenuation; Coplanar waveguides; Equalizers; Equivalent circuits; Integrated circuit modeling; Optimization; Propagation losses; Common-mode suppression; differential-mode equalizer; equalization; frequency-dependent loss; high-speed differential transmission; signal integrity (SI);
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2246275
  • Filename
    6471768