• DocumentCode
    73109
  • Title

    The Study of Thermal Resistance Deviation of High-Power LEDs

  • Author

    Shang-Pin Ying ; Han-Kuei Fu ; Wei-Feng Tang ; Rong-Ci Hong

  • Author_Institution
    Dept. of Opto-Electron. Syst. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan
  • Volume
    61
  • Issue
    8
  • fYear
    2014
  • fDate
    Aug. 2014
  • Firstpage
    2843
  • Lastpage
    2848
  • Abstract
    The high-power light-emitting diode (LED) lighting is especially essential in the high-temperature applications, such as the street lighting and automotive lighting. However, there is more than 70% of electrical power converted into heat due to the low electrical-optical conversion efficiency. Because of the characteristics of the semiconductor, the electrical property of LEDs is sensitively varying with operating temperature. These deviations affect the measurement of light and electricity. In this paper, the steady-state thermal measurement techniques developed by the National Institute of Standards and Technology are used to study the deviation of thermal resistance in different electrical and thermal conditions. The consistent trends of simulations and experiments represent that the design of the heat dissipating path and geometry affects the measurement of thermal resistance.
  • Keywords
    cooling; light emitting diodes; street lighting; thermal resistance; thermal resistance measurement; automotive lighting; electrical-optical conversion efficiency; heat dissipating path; high-power LED; high-temperature applications; light emitting diode lighting; steady-state thermal measurement techniques; street lighting; thermal resistance deviation; Electrical resistance measurement; Heat sinks; Light emitting diodes; Resistance heating; Temperature measurement; Thermal resistance; Light-emitting diode (LED); thermal engineering; thermal measurement; thermal resistance; thermal resistance.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2330340
  • Filename
    6845354