DocumentCode
731104
Title
The influence of annealing on fluorene-type thin film produced by biphenyl and methane RF plasma system
Author
Mansuroglu, Dogan ; Bilikmen, Sinan
Author_Institution
Phys. Dept., Middle East Tech. Univ., Ankara, Turkey
fYear
2015
fDate
24-28 May 2015
Firstpage
1
Lastpage
1
Abstract
Fluorene (C13H10)-type thin films were produced under the capacitively coupled single radio frequency (rf) system by using the biphenyl (C12H10)/methane (CH4) plasma. The circular parallel plate electrodes were used; the upper electrode was connected to 13.56 MHz rf power while the lower electrode was grounded. To control the positive ion bombardment, a negative bias voltage was applied between the holder of the substrate and the wall of the chamber. The properties of the fluorene-type films were explored under the variable plasma parameters of input rf power (150, 200 W), CH4 flow rate (3, 5 sccm), negative bias voltage (-66 V), and deposition time (20, 30 min) at a constant pressure value of 0.3 mbar. The deposited films were annealed for 1 hour at different temperatures; 200, 300, 400, and 500 C̊. The changes of plasma chemistry during the deposition were investigated by optical emission spectroscopy (OES). The chemical structural properties were examined by fourier transform infrared (FTIR) spectroscopy. After annealing the sp3/sp2 ratio showed a decrease with increasing temperature due to the degassing of CHx from the surface and hydrogen release with temperature1. The reconfiguration of chemical bonds in the film structure with annealing caused the changes in the intensities of band peaks2. Additionally, the annealing increased the amount of sp1 carbon bonding (carbyne) in the deposited film and led to decrease in the degree of cross-linking. The morphology of the films was analyzed by X-ray diffraction (XRD) and atomic force microscope (AFM). The crystallography of thin film was effectively changed at high rf power and the annealing caused a shifting in diffraction peaks. An increase was observed in crystalline size of the films after the annealing. The surface of thin film indicated significant nanostructures and peaks - t high rf power and CH4 flow rate. After annealing, the intensity of peaks showed a decrease as a result of the decomposition and compaction of films as well as the reformation of the amorphous covalent network that is occurring smoother surfaces2,3. The thickness was measured by ellipsometer, and since the annealing temperature caused to an effective thermal decay and a disruption of microvoids in the films2, the thickness of thin films had a decrease as increased the temperature. The contact angle measurement was used for the determination of hydrophobic behavior of the thin films.
Keywords
Fourier transform infrared spectra; X-ray diffraction; amorphous state; annealing; atomic force microscopy; compaction; contact angle; electrodes; hydrophobicity; nanofabrication; nanostructured materials; plasma chemistry; plasma deposition; plasma diagnostics; pyrolysis; thin films; voids (solid); (C12H10)-(CH4) plasma; AFM; C13H10; CH4 flow rate; FTIR spectroscopy; Fourier transform infrared spectroscopy; OES; X-ray diffraction; XRD; amorphous covalent network; annealing; atomic force microscopy; biphenyl-methane plasma; capacitively coupled single radio frequency system; carbon bonding; chamber wall; chemical bonds; chemical structural properties; circular parallel plate electrodes; compaction; contact angle; crystalline size; decomposition; ellipsometry; film morphology; film structure; fluorene-type thin film; frequency 13.56 MHz; high rf power; hydrogen release; hydrophobic behavior; input rf power; ion bombardment; microvoids; nanostructured material; negative bias voltage; optical emission spectroscopy; plasma chemistry; plasma deposition; plasma parameters; power 150 W; power 200 W; pressure 0.3 mbar; smooth surface; substrate holder; surface release; temperature 200 degC to 500 degC; thermal decay; thin film crystallography; thin film thickness; time 1 hour; time 20 min; time 30 min; Annealing; Electrodes; Films; Plasma temperature; Radio frequency; Surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Sciences (ICOPS), 2015 IEEE International Conference on
Conference_Location
Antalya
Type
conf
DOI
10.1109/PLASMA.2015.7179567
Filename
7179567
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